TPC-B300-J20A Modular TPC - Computing Box Module with Intel Atom and Celeron CPU

TPC-B300 computing box modules are powered by Intel® Atom™ X6425E/Celeron® J6412 Processors to provide compact and fanless control panel solutions that deliver high-performance computing. With a highly flexible modular design, TPC-B300 allows users to change the panel sizes (12"-23.8").

Introduction

The TPC-B300-J20A is a computing box module panel PC designed for compact and fanless control panel solutions, powered by Intel® Celeron® J6412 processors. It offers a flexible modular design, allowing users to easily change panel sizes.

Key Features

• Processor: Intel® Celeron® J6412, quad-core, 2.00 GHz.
• Memory: 1 x DDR4 SO-DIMM slot, up to 32GB.
• Storage:
  • 1 x M.2 Key-M 2280 (for NVMe SSD)
  • 1 x 2.5" SSD/HDD slot
• Connectivity:
  • 2 x LAN Intel® I226; 2.5GbE
  • 1 x full-size mini PCIe
  • 1 x M.2 Key-E 2230 for WIFI + BT module
• I/O:
  • 2 x RS-232/422/485
  • 3 x USB 3.2, 1 x USB 2.0
  • 1 x Line out
  • 1 x Display Port (max resolution 4096x2160 @ 60Hz)
• Security: Built-in TPM 2.0.

Environmental Specifications

• Operating Temperature:
  • Celeron J6412 with SATA SSD: 0°C to 60°C
  • Celeron J6412 with NVMe SSD: 0°C to 55°C
• Storage Temperature: -20°C to 70°C
• Humidity: 95% RH at 40°C, non-condensing
• Ingress Protection: IP66 (with optional panel mount module)

Dimensions and Mounting

• Dimensions: 269 x 203 x 30 mm
• Weight: 2.1 kg
• Mounting: VESA, wall or panel mount (VESA mount kit TPC-5000T-VMKE required)

Power Consumption

• Input: 24 VDC ± 20%
• Consumption:
  • Typical: 21W (box only)
  • Maximum: 50W (box only)

Available Panel Modules

• Various panel sizes available (12.1" to 23.8") with resolutions ranging from 1024x768 to 1920x1080 and brightness options up to 1800 nits.

Certifications and OS Support

• Certifications: CE, FCC Class A, CB/UL
• Operating Systems: Windows 10 IoT Enterprise LTSC

Conclusion

The TPC-B300-J20A is a powerful and versatile modular panel PC, ideal for industrial applications requiring high performance and flexible options in panel size and connectivity.